Artificial intelligence (AI) technology has become a new driving force for global economic growth. Especially with the rapid development of Generative AI (Gen AI) technology, the global AI semiconductor market is showing an explosive growth trend. According to industry authoritative institutions, the global AI semiconductor market is expected to reach an astonishing 159 billion US dollars by 2028, with a compound annual growth rate (CAGR) of 24.3%.

This prediction data is based on in-depth analysis of current market trends and optimistic estimates of future development. From the market performance in 2023, the rapid rise of global generative AI technology has significantly driven the growth of the AI semiconductor market. According to statistics, the global revenue of AI semiconductors reached 53.7 billion US dollars in 2023, an increase of nearly 30% compared to the previous year. This achievement not only demonstrates the strong market potential of AI technology, but also indicates that the AI semiconductor market will continue to maintain high-speed growth in the future.

Driven by the continuous progress of Gen AI technology, the demand for AI chips, as an important carrier of artificial intelligence technology, will continue to grow. However, facing this strong market demand, the Taiwan based packaging and testing supply chain is facing increasingly tense challenges. Especially the shortage of advanced packaging capacity such as CoWoS has become a key factor restricting further market development.

In response to this challenge, a large number of advanced packaging orders have begun to flow to professional packaging and testing outsourcing (OSAT) and testing factories. As an important component of the global semiconductor industry chain, the packaging and testing industry in Taiwan has become an important support for the global AI semiconductor market due to its technological advantages and industry chain integration capabilities. Among the top ten semiconductor OSAT manufacturers in the world, six are Taiwanese companies, including well-known companies such as SunMoon, Silicon Products, Jingyuan Electric, Qibang, and Nanmao. At the same time, Taiwan also has four major testing interface manufacturers, including Yingwei, Wangsi, Yongzhi, and Jingce, providing comprehensive testing services for AI chips.

With the continuous development of AI technology and the expansion of application scenarios, the global AI semiconductor market will continue to maintain high-speed growth. At the same time, with the continuous improvement of the industrial chain and the continuous promotion of technological innovation, the Taiwan based packaging and testing supply chain will also usher in broader development space. As an important participant in the global AI semiconductor market, semiconductor companies in Taiwan will continue to play a key role in the industry chain and promote the sustainable development of the global AI semiconductor market.

Faust Technology focuses on the field of power devices, providing customers with power devices such as IGBT and IPM modules, as well as MCU and touch chips. It is an electronic component supplier and solution provider with core technology.